In short, the PCBA process is a combination of SMT processing and DIP processing. According to the requirements of different production technologies, it can be divided into single-sided SMT placement process, single-sided DIP insertion process, single-sided mixing process, single-sided stickers. Packing and inserting mixing process, double-sided SMT placement process and double-sided mixing process, etc.
Both SMT and DIP are ways to integrate parts on the PCB. The main difference is that SMT does not need to drill holes in the PCB. In DIP, the PIN pin of the part needs to be inserted into the hole that has been drilled.
SMT (Surface Mounted Technology)
Surface mount technology mainly uses the placement machine to mount some micro-miniature parts onto the PCB. The production process is: PCB board positioning, printing solder paste, placement machine placement, over-reflow oven and inspection. With the development of technology, SMT can also mount some large-sized parts, for example, some large-sized mechanical parts can be mounted on the motherboard. SMT integration is sensitive to positioning and part size, and solder paste quality and print quality also play a key role.
DIP(Double In-line Package)
DIP is a “plug-in”, that is, inserting parts on the PCB version. Because the part size is large and it is not suitable for placement or the manufacturer’s production process cannot use SMT technology, the parts are integrated in the form of plug-ins. At present, there are two implementations of manual plug-ins and robot plug-ins in the industry. The main production processes are: adhesive backing (to prevent tin plating from being undone), plug-in, inspection, wave soldering, brushing (removing in the furnace) The stains left in the process) and finished inspection.
PCBA production process
PCBA production process can be divided into several large processes, SMT processing → DIP processing → PCBA Testing → Finished product assembly